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Depth profiling of ultratrace chromium, iron, nickel, and copper in silicon wafers by electrothermal vaporization/ICP-MS

Determination of ultra-trace copper on silicon wafer by

Keywords: determination of copper on silicon wafer surface, neutron activation analysis, packing material during irradiation in a nuclear reactor

Adsorption and Copper Filling for Through Silicon Via

Effect of Reverse Pulse on Additives Adsorption and Copper Filling for Through Silicon Via(Downloading may take up to 30 seconds. If the slide opens in

and variability of silicon, copper and zinc in different

This study presents, for the first time, reference values for silicon (Si), copper (Cu) and zinc (Zn) concentrations in stems and leaves of various

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An aluminum alloy composition consists essentially of controlled amounts of iron, silicon, copper, manganese, magnesium, titanium, zinc, zirconium, and free

in Conjunction with Substitution on Silicon in Copper(I)

Silyl Migration in Conjunction with Substitution on Silicon in Copper(I) t-Butoxide-promoted Coupling between o-Silylphenyl Ketones and Organic Halides

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Iron oxide (Fe3O4) and copper-functionalized silicon nanowires (SiNWs) from silicon powder mesh  500 with a spherical structure have

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We produce low‐reflectivity nanostructured ‘black’ silicon (bSi) using copper (Cu) nanoparticles as the catalyst for metal‐assisted etching

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Subramaniam, C.; Yasuda, Y.; Takeya, S.; Ata, S.; Nishizawa, A.; Futaba, D.; Yamada, T.; Hata, K., 2014: Carbon nanotube-copper exhibiting

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Silicon Oxide Thin Films Doped with Zinc and Copper Grown

Antibacterial Silicon Oxide Thin Films Doped with Zinc and Copper Grown by embedded into a SiOx film formed by particles of up to 200–300 nm in

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Adsorption and Copper Filling for Through Silicon Via

Effect of Reverse Pulse on Additives Adsorption and Copper Filling for Through Silicon ViaQ. S. Zhu1z, X. Zhang1z, C. Z. Liu2z and H. Y

Cu-Ni-Si (Copper-Nickel-Silicon) | SpringerLink

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Copper Microstructure Evolution in Light-Induced Plated Metal Grids for Silicon Solar Cells: Implications for Reliable Metallization

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deposition of micro-tungsten tracks on silicon, copper and

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The following outline is provided as an overview of and topical guide to solar energy: Solar energy –radiant light and heat from the sun. It has

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silicon added to the epoxy resin 4% in order to get an improvement in the hardness of epoxy, While increasing the proportion of copper particles added

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Bottom-Up Copper Filling of Large Scale Through Silicon Vias

Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology(Downloading may take up to 30 seconds. If the slide opens in your